Method of forming a stable mnos igfet

ABSTRACT

An MNOS IGFET device is formed by a process that eliminates or substantially minimizes contamination during formation and that results in a stabilized semiconductor device having a high field inversion threshold.

nited States Patent Abbink et al.

METHOD OF FORMING A STABLE MNOS IGFET Inventors: Henry C/Abbink, Westlake Village; Norman W. Goodwin, Encino, both of Calif.

Assignee: Litton Systems, Inc., Beverly Hills,

Calif.

Filed: May 22, 1972 Appl. No.: 255,281

US. Cl. 29/571, 29/578 Int. Cl B0lj 17/00 Field of Search 29/571, 578; 317/235 B [111 3,8MAM

[ Apr. 2, 1974 [56] References Cited UNITED STATES PATENTS 3,707,656 12/1972 Dewitt 317/235 B 3,724,065 4/1973 Carbajal et al. 29/578 Primary ExaminerW. C. Tupman [57] ABSTRACT An MNOS IGFET device is formed by a process that eliminates or substantially minimizes contamination during formation and that results in a stabilized semiconductor device having a high field inversion threshold.

15 Claims, 3 Drawing Figures PMENTEDAPR 2 m4 3,800.41 1

I I6 FIG. 2 FIG. 3 FORM PROTECTIVE LAYER L\\\\\ O N SUBSTRATE l 3 4O 36 OPEN WINDOWS IN L i k Ix xix M20 OXIDE LAYER Mm DIFFUSE OOPANT INTO SUBSTRATE REM VE OXIDE LAYER AND CLEAN FORM OXIDE LAYER K 1 ON SUBSTRATE ICU II I

. 22 FORM NITRIDE LAYER F I @yu-z ON OXIDE LAYER '2 32 28 v 1 l, I I FORM OXIDE LAYER G 22 ON NITRIDE LAYER 4 f SELECTED SUBSTRATE AND NITRIDE REGIONS OPEN WINDOWS TO W 32 1 METHOD OF FORMING A STABLE MNOS IGFET BACKGROUND OF THE INVENTION Metal oxide semiconductors (MOS) and metal nitride oxide semiconductors (MNOS) Have been described and developed for use in electronic circuits. (See S. R. I-Iofstein and F. P. Heiman, The Silicon Insulated-Gate Field-Effect Transistor, Proc. IEEE, Vol.

51, No.9, p. 1,190, Sept. 1963.

See also U. S. Pat. No. 3,650,530, granted Jan. 18, 1972, assigned to the same assignee as the present invention.) However, the development of MOS and MNOS devices is not without its problems.

One common method of producing these devices, and particularly MNOS devices for use as an insulatedgate field-effect transistor (IGFET), includes several processing steps which are directed to the growth of selected oxide layers. Because these oxide layers are relatively thick, between 3,000 and 10,000 A., oxidation is completed at relatively high temperatures and for extended time periods. It is, therefore, extremely difficult to prevent these oxide layers from becoming contaminated with mobile impurities. Also, these impurities can diffuse into a gate oxide layer, between 500 to 1,000 A. thick, and lead to ionic drift instability in the device.

U. S. Pat. No. 3,411,199, granted Nov. 19, 1968, is directed to the preparation of a semiconductor device wherein a solution to the problem of contaminated oxide layers is taught. However, the problem of ionic drift instability remains.

OBJECTS OF THE INVENTION Accordingly, it is an object of the invention to provide a new and improved method of producing an MNOS device. g

It is an object of the invention to provide a method of producing an MNOS device having a relatively thick hysteresis inhibiting or stabilizing oxide layer.

It is an object of the invention to provide a method of producing an MNOS device wherein a stabilizing oxide layer and a contiguous nitride layer can be sequentially grown without exposure to an ambient atmosphere.

It is an object of the invention to provide a method of producing an MNOS device having a substantially reduced probability of threshold shift due to induced migration of mobile ions.

SUMMARY OF THE INVENTION Briefly, in accordance with the invention, a method of producing an MNOS IGFET device is provided including the steps of removing a protective coating from an altered substrate, cleaning the exposed substrate, sequentially growing a hysteresis inhibiting or stabliizing layer, an ion-impermeable layer, and a protective layer, so that a relatively high field inversion threshold is developed, and forming a plurality of selectively positioned electrodes.

While the specification concludes with claims particularly pointing out and distinctly claiming the subject matter which may be regarded as the invention, the organization and method of operation, together with further objects, features. and the attending advantages thereof, may best be;u'nderstood when the following description is read in connection with the accompanying drawing.

BRIEF DESCRIPTION OF THE DRAWING FIG. 1 is a greatly enlarged sectional view of one MNOS IGFET device formed in accordance with the method of the present invention.

FIG. 2 is a flow chart of the steps in producing the MNOS device of FIG. 1.

FIG. 3 is a series of greatly enlarged sectional views of the MNOS device of FIG. 1 corresponding to the steps in the flow chart of FIG. 2.

DESCRIPTION OF THE INVENTION Referring to FIG. 1, one MNOS device 10 formed in accordance with the method of the present invention is illustrated as an IGFET. A substrate wafer 12, preferably N-type silicon, has P-type regions 14 and 16 formed into the N-type silicon. A relatively thick silicon dioxide (SiO layer 18 is formed over surface 20 of the substrate wafer 12. A silicon-nitride (Si N layer 22 is formed over the silicon-dioxide layer 18. Openings are provided through the silicon-dioxide layer 18 and silicon-nitride layer 22 for a metal source electrode 24 that is in electrical continuity with source region 14, and for a metal drain electrode 26 that is in electrical continuity with drain region 16. A silicon-dioxide layer 28 covers the silicon nitride layer 22, and has openings for the electrodes 24 and 26. An additional opening is provided in the layer 28 for a metal gate electrode 30 that contacts the surface 32 of the silicon-nitride layer 22.

In FIG. 2, and the accompanying illustrations in FIG. 3 corresponding to the process of FIG. 2, the MNOS IGFET 10 of FIG. 1 is formed by thermal growth of an oxide diffusion mask layer or coating 36 on substrate 12 which may be phosphorous doped silicon that has been suitably prepared by standard procedures for the oxide layer 36. Since this oxide layer is subsequently removed, the exact thickness is not critical; however, it can be between 2,000 and 10,000 A. Openings or windows 38 and 40 are formed through oxide layer 36 exposing predetermined regions of the surface 20 of the substrate 12. A P-type dopant such as boron is diffused through windows 38 and 40 in a conventional manner, and a P-type source region 14 and a P-type drain region 16 formed in the substrate 12. Then the oxide layer 36 is stripped from the substrate 12 and the then exposed surface 20 cleaned; for example, water wash, alkaline wash, deionized-water wash, and nitrogen dried. The condition of the IGFET 10 at this stage is illustrated by FIG. 3D.

The cleaned substrate 12 is placed on a quartz surface or graphite susceptor in a controlled atmosphere furnace. A silicon dioxide hysteresis inhibiting or stabilizing layer 18 is then formed on the substrate surface 20 to a thickness between and and 1,000 A. by the oxidation of the substrate surface at a temperature between 800 and l,000 C. which is determined by the desired thickness of layer 18.

A silicon nitride layer 22 is next formed on the stabilizing layer 18 by the ammonization of silane (siH in a furnace. The furnace used can be the same furnace used in the formation of the layer 18. It is preferred that both the stabilizing oxide layer 18 and the nitride layer 22 are formed sequentially in the same furnace so that the silicon dioxide layer 18 is not exposed to ambient before the formation of the nitride layer 22.

The ammonization of silane can be at the following flow rates: SiH, between 10 and 100 cubic centimeters per minute (cc/min): Nl-l between 1 and 100 liters per minute (l/min); and, N between 10 and 100 l/min. For example, a silicon nitride layer has been formed with SiH, at 10 cc/min, NH at 50 l/min, and N at 70 l/min. The resulting silicon nitride layer 22 can have a thickness between 200 and 2,000 A. This silicon nitride layer 22 provides an ion impermeable layer on the stabilizing layer 18.

A silicon dioxide layer 28 is then formed on the exposed surface 32 of the silicon nitride layer 22 by the oxidation of silane in a furnace. The furnace used can be the same furnace used in the formation of layers 18 and 22; however, the furnace used 'in the formation of I the protective silicon dioxide layer 28 generally will be a separate controlled atmosphere furnace.

The oxidation of silane can be at the following flow rates: Sil-l, between and cc/min; 0 between 100 and 1,000 cc/min; and, N between 10 and 100 l/min. For example, a silicon dioxide layer has been formed with SiH, at 16 cc/min, 0 at 180 cc/min, and N at 40 l/min. The resulting silicon dioxide layer 28 can have a thickness between 5,000 and 10,000 A. The silicon dioxide layer 28 forms a protective layer and, since the protective layer is relatively thick, provides a high field inversion threshold so that coupling does not occur between source and drain lines where gates lines cross such source and drain lines, particularly in integrated circuits. The lGFET 10 at this stage is illustrated by FIG. 30.

Source, gate, and drain openings or windows 42, 44 and 46, respectively, are formed in the silicon oxide layer 28 exposing predetermined regions of the surface 32 of the silicon nitride layer 22. Windows 42 and 46 are illustrated by FIG. 3H as respectively adjacent to source region 14 and drain region 16, while window 44 is positioned generally therebetween. The exact size and shape of windows 42, 44, and 46 is not critical, and where the source and drain regions 14 and 16, respectively, have the same size and shape, the source and drain regions may be interchanged without affecting the electrical characteristics of the resulting IGFET device.

Windows 42 and 46 are additionally formed to open through the silicon nitride layer 22 and the silicon oxide layer 18 and expose the surface 20 of the substrate 12 at the respective source region 14 and drain region 16.

An electrically conductive metal is then deposited in a conventional manner on the exposed surface of the silicon dioxide layer 28 and thus into the windows 42 and 46 to cover the previously exposed surfaces of source and drain regions 14 and 16, respectively, and into the window 44 to cover the previously exposed surface 32 of the silicon nitride layer 22. The metal is then photoetched in a conventional manner leaving a source electrode 24, a drain electrode 26, and a gate electrode 30 as illustrated by FIG. 31.

As will be evidenced from the foregoing description, certain aspects of the invention are not limited to the particular details of construction as illustrated, and it is contemplated that other modifications and applications will occur to those skilled in the art. It is, therefore, intended that the appended claims shall cover such modifications and applications that do not depart from the true spirit and scope of the invention.

We claim: 1. The method of forming a semiconductor device comprising:

a. forming a protective coating on predetermined regions of a substrate surface thereby defining unprotected regions,

b. altering the conductivity of the substrate at the unprotected regions.

c. removing the protective coating from the substrate surface,

d. cleaning the exposed substrate surface,

e. growing sequential layers on the clean substrate surface in a controlled environment, the layers including l. a hysteresis inhibiting layer having a thickness between A and 1000A on the substrate surface,

2. an ion impermeable layer having a thickness between 200 A and 2000 A on the hysteresis inhibiting layer,

3. a protective layer having a thickness between 5000 A and 10,000 A on the ion impermeable layer, and

f. forming a plurality of conductive electrodes includmg 1. a first electrode on one of the altered substrate regions,

2. a second electrode on another of the altered substrate regions,

3. a third electrode on the impermeable layer generally between and adjacent to said first and second electrodes.

2. The method of claim 1 in which said hysteresis inhibiting layer is silicon dioxide.

3. The method of claim 2 in which said growing of said layer is by the oxidation of a silicon substrate.

4. The method of claim 1 in which said ionimpermeable layer is silicon nitride.

5. The method of claim 4 in which said growing of said ion-impermeable layer is by the ammonization of silane.

6. The method of claim 1 in which said protective layer is silicon dioxide.

7. The method of claim 6 in which said growing of said protective layer is by the oxidation of silane.

8. The method of claim 1 in which said growing of said hysteresis inhibiting layer and of said ionimpermeable layer is sequentially completed in a controlled atmosphere furnace without exposure to the ambient.

9. The method of claim 1 in which respective ones of said first and second electrodes are source and drain electrodes and said third electrode is a gate electrode.

10. The method of claim 1 in which said protective coating is a temporary oxide layer.

11. The method of claim 1 in which said ionimpermeable layer has a dielectric constant greater than said hysteresis inhibiting layer.

12. The method of claim 1 in which cleaning said exposed substrate surface eliminates contaminants.

13. The method of claim 12 in which said contaminants include oxide.

14. The method of forming a semiconductor device comprising:

a. growing a protective oxide layer on a silicon substrate,

b. opening windows through said protective oxide layer at predetermined regions to expose the substrate,

c. diffusing a suitable dopant through the windows into the exposed substrate to form altered areas in the substrate,

d. stripping the protective oxide layer from the silicon substrate,

e. cleaning the stripped and exposed substrate surface,

f. growing a hysteresis inhibiting oxide layer having a thickness between 100 and 1,000 A. on the clean substrate surface,

g. depositing an ion-impermeable silicon nitride layer having a thickness between 200 and 2,000 A. on the hysteresis inhibiting oxide layer,

h. depositing a protective silicon dioxide layer having 6 a thickness between 5,000 and 10,000 A. on the silicon nitride layer,

i. opening at least a first window in the silicon dioxide layer at a predetermined region to expose the silicon nitride layer,

j. depositing a metal layer at said window opening, and k. photoetching the resulting metal layer to form an electrode having a selected electrical characteristic.

15. The method of claim 14 in which the step of opening at least a first window further includes opening a plurality of windows to expose said altered substrate areas, depositing the metal layer at said window openings, and photoetching the metal layer to form a plurality of electrodes having selected electrical characteristics of gate, source, and drain.

CER'IIFIGA'IE OF CORRECTION Patent No. 3 800 4 711. I Dated April 2, 1974 Inventofls) Henry C. Abbinkand Norman W. Goodwin It is certified that error appears in the above-identified patent and that saidt'Letters Patent are hereby corrected as shown below:

IN THE SPECIFICATION .colurmi '1, line '19, BACKGROUND OF THE INVENTION after the word "between" delete "3,000 and 10,000 A" P and Add 3 ,000 Angs tror h s (A) and IN THE CLAIMS Claim 14, paragraph line 12, after ."lOO" and before "and" add A 7 paragraph CIA, line 15, after "200" and before I "and" add A 7 are-graph h., line 1, after "5,000" and before "and" add A f signed majeuua tats 3rd day of September 1974.

(SEAL) Attest:

MCCOY M. GIBSON,. JR. f I c.- MARSHALL DANN 0 Commissioner of Patents Attesting Officer A 

1. The method of forming a semiconductor device comprising: a. forming a protective coating on predetermined regions of a substrate surface thereby defining unprotected regions, b. altering the conductivity of the substrate at the unprotected regions, c. removing the protective coating from the substrate surface, d. cleaning the exposed substrate surface, e. growing sequential layers on the clean substrate surface in a controlled environment, the layers including
 1. a hysteresis inhibiting layer having a thickness between 100 A and 1000A on the substrate surface,
 2. an ion impermeable layer having a thickness between 200 A and 2000 A on the hysteresis inhibiting layer,
 3. a protective layer having a thickness between 5000 A and 10,000 A on the ion impermeable layer, and f. forming a plurality of conductive electrodes including
 1. a first electrode on one of the altered substrate regions,
 2. a second electrode on another of the altered substrate regions,
 3. a tHird electrode on the impermeable layer generally between and adjacent to said first and second electrodes.
 2. an ion impermeable layer having a thickness between 200 A and 2000 A on the hysteresis inhibiting layer,
 2. a second electrode on another of the altered substrate regions,
 2. The method of claim 1 in which said hysteresis inhibiting layer is silicon dioxide.
 3. The method of claim 2 in which said growing of said layer is by the oxidation of a silicon substrate.
 3. a tHird electrode on the impermeable layer generally between and adjacent to said first and second electrodes.
 3. a protective layer having a thickness between 5000 A and 10, 000 A on the ion impermeable layer, and f. forming a plurality of conductive electrodes including
 4. The method of claim 1 in which said ion-impermeable layer is silicon nitride.
 5. The method of claim 4 in which said growing of said ion-impermeable layer is by the ammonization of silane.
 6. The method of claim 1 in which said protective layer is silicon dioxide.
 7. The method of claim 6 in which said growing of said protective layer is by the oxidation of silane.
 8. The method of claim 1 in which said growing of said hysteresis inhibiting layer and of said ion-impermeable layer is sequentially completed in a controlled atmosphere furnace without exposure to the ambient.
 9. The method of claim 1 in which respective ones of said first and second electrodes are source and drain electrodes and said third electrode is a gate electrode.
 10. The method of claim 1 in which said protective coating is a temporary oxide layer.
 11. The method of claim 1 in which said ion-impermeable layer has a dielectric constant greater than said hysteresis inhibiting layer.
 12. The method of claim 1 in which cleaning said exposed substrate surface eliminates contaminants.
 13. The method of claim 12 in which said contaminants include oxide.
 14. The method of forming a semiconductor device comprising: a. growing a protective oxide layer on a silicon substrate, b. opening windows through said protective oxide layer at predetermined regions to expose the substrate, c. diffusing a suitable dopant through the windows into the exposed substrate to form altered areas in the substrate, d. stripping the protective oxide layer from the silicon substrate, e. cleaning the stripped and exposed substrate surface, f. growing a hysteresis inhibiting oxide layer having a thickness between 100 and 1,000 A. on the clean substrate surface, g. depositing an ion-impermeable silicon nitride layer having a thickness between 200 and 2,000 A. on the hysteresis inhibiting oxide layer, h. depositing a protective silicon dioxide layer having a thickness between 5,000 and 10,000 A. on the silicon nitride layer, i. opening at least a first window in the silicon dioxide layer at a predetermined region to expose the silicon nitride layer, j. depositing a metal layer at said window opening, and k. photoetching the resulting metal layer to form an electrode having a selected electrical characteristic.
 15. The method of claim 14 in which the step of opening at least a first window further includes opening a plurality of windows to expose said altered substrate areas, depositing the metal layer at said window openings, and photoetching the metal layer to form a plurality of electrodes having selected electrical characteristics of gate, source, and drain. 